- Path:
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Are You Kidding? Yes, It Can Be Done!! An Experience Report from Metallography and Materials Testing
Files
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Periodical
- Title:
- Practical metallography
- Parallelsachtitel:
- Praktische Metallographie
- Publication:
-
Berlin: de Gruyter
- Note:
- Erscheint zwölfmal jährlich
- Reihenfolge zwischen Haupttitel und Paralleltitel wechselt
- Gesehen am 18.08.2021
- Text dt. und engl.
- Scope:
- Online-Ressource
- ISSN:
- 2195-8599
- ZDB-ID:
-
2473408-1
- VÖBB-Katalog:
- 35290016
- Keywords:
- Metallographie ; Zeitschrift ; Zeitschrift
- Classification:
- Technik
- DDC Group:
- 600 Technik
- Collection:
- Technik
- Copyright:
- Rights reserved
- Accessibility:
- Eingeschränkter Zugang mit Nutzungsbeschränkungen
- Title:
- Practical metallography
- Parallelsachtitel:
- Praktische Metallographie
- Publication:
-
Berlin: de Gruyter
- Note:
- Erscheint zwölfmal jährlich
- Reihenfolge zwischen Haupttitel und Paralleltitel wechselt
- Gesehen am 18.08.2021
- Text dt. und engl.
- Scope:
- Online-Ressource
- ISSN:
- 2195-8599
- ZDB-ID:
-
2473408-1
- VÖBB-Katalog:
- 35290016
- Keywords:
- Metallographie ; Zeitschrift ; Zeitschrift
- Classification:
- Technik
- DDC Group:
- 600 Technik
- Collection:
- Technik
- Copyright:
- Rights reserved
- Accessibility:
- Eingeschränkter Zugang mit Nutzungsbeschränkungen
Are You Kidding? Yes, It Can Be Done!! An Experience Report from Metallography and Materials Testing
Article
- Title:
- Are You Kidding? Yes, It Can Be Done!! An Experience Report from Metallography and Materials Testing
- Publication:
-
Berlin: de Gruyter, 2026
- Language:
- English
- Information:
- Abstract: The continuing miniaturization of electronic components presents new challenges for metallography and mechanical materials testing. Very small dimensions, sensitive materials, and severely damaged components require careful adaptation of specimen preparation, testing techniques, and microscopic evaluation. Several application examples demonstrate how such tasks can be addressed using suitable metallographic and mechanical methods. The investigations focus on the examination of failure features, the assessment of mechanical load-bearing capacity, and the visualization of corrosion-related changes. The practical experience presented in this article demonstrates that even unusual testing tasks that initially appear difficult to accomplish can be successfully resolved when the methods employed are consistently adapted to the individual specimen and objective.
- Scope:
- Online-Ressource
- Note:
- Open Access unbekannt
- Archivierung/Langzeitarchivierung gewährleistet
- Keywords:
- Metallography ; electronic components ; chip-size packages (CSPs) ; IGBT modules ; aluminum wire bonds ; Metallographie ; elektronische Bauelemente ; Chip-Size-Packages (CSPs) ; IGBT-Module ; Aluminiumdrahtbonds
- Classification:
- Technik
- Wirtschaft
- Collection:
- Technik
- Wirtschaft
- Copyright:
- Rights reserved
- Accessibility:
- Eingeschränkter Zugang mit Nutzungsbeschränkungen
- Title:
- Are You Kidding? Yes, It Can Be Done!! An Experience Report from Metallography and Materials Testing
- Publication:
-
Berlin: de Gruyter, 2026
- Language:
- English
- Information:
- Abstract: The continuing miniaturization of electronic components presents new challenges for metallography and mechanical materials testing. Very small dimensions, sensitive materials, and severely damaged components require careful adaptation of specimen preparation, testing techniques, and microscopic evaluation. Several application examples demonstrate how such tasks can be addressed using suitable metallographic and mechanical methods. The investigations focus on the examination of failure features, the assessment of mechanical load-bearing capacity, and the visualization of corrosion-related changes. The practical experience presented in this article demonstrates that even unusual testing tasks that initially appear difficult to accomplish can be successfully resolved when the methods employed are consistently adapted to the individual specimen and objective.
- Scope:
- Online-Ressource
- Note:
- Open Access unbekannt
- Archivierung/Langzeitarchivierung gewährleistet
- Keywords:
- Metallography ; electronic components ; chip-size packages (CSPs) ; IGBT modules ; aluminum wire bonds ; Metallographie ; elektronische Bauelemente ; Chip-Size-Packages (CSPs) ; IGBT-Module ; Aluminiumdrahtbonds
- Classification:
- Technik
- Wirtschaft
- Collection:
- Technik
- Wirtschaft
- Copyright:
- Rights reserved
- Accessibility:
- Eingeschränkter Zugang mit Nutzungsbeschränkungen
